FAQ
Frequently Asked Questions
- What is it?
It is an organic material that we are surrounded by in the ambient environment and comes in to our businesses and homes through natural infiltration. - Why does it appear in your home/business?
Normally, when you have elevated and extreme moisture content, emergent discharges of water, or persistent water intrusion. The science says that mold can start forming in as little as 24-48 hours if conditions are not augmented substantially. - What are the harmful effects?
Some molds are potentially pathogenic to humans, you can overload or desensitize your body with over exposure, diseases like aspergillosis, where mold/fungi starts growing in your lungs. - How do you treat/remove it?
First would be to eliminate the source of water intrusion. Then remove the excess moisture content where possible. Then determine what and how much material actually needs to be removed or can be dried in place. Depending on the extent may require full enclosure. We wet the material with surfactant/anti-microbial agent, remove it, bag it and dispose of it as regular construction debris.
- What is it?
A mineral that has been mined from the earth. Earliest known uses include Finnish Pottery, Ancient Romans, Ancient Greeks and even in Ancient Egypt - Why does it appear in your home/business?
Used as an admixture and/or binding agent in building materials. Is known for its amazing properties, some of which are; fire resistant, chemical resistant, sound dampening, poor electrical conductivity. - What are the harmful effects?
It is considered toxic and a known carcinogen. OSHA stipulates there is know known safe level of asbestos exposure. - How do you treat/remove it?
Most removals involve an isolation chamber, known as a containment or enclosure with a HEPA filter, ventilation device, that is supposed to be dumped back into outside ambient air to create a negative pressure enclosure. Then we wet the material with a surfactant, remove it, double bag it, label and take it to a Florida approved landfill.